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ESEC ESEC Smart Card Line
used
- Manufacturer: ESEC
- Model: SMART CARD LINE
Model: ESEC DA & Bondztek Inline Oven Smart Card line with ESEC DA; Bondztek Inline Oven including Reel handler Ex-Works. A complete ESEC smart card line with ESEC 2008HS3 Plus , Bondztek Inline Oven, Reel handle...
Malacca, Malaysia - Trusted Seller
ESEC DA & Inline Oven Smart Card Line
used
- Manufacturer: ESEC
Smart Card line with ESEC DA and ESEV Oven including Reel in/out A complete ESEC smart card line with ESEC 2008HS3 Plus , ESEC Inline Oven, ESEC Reel In/Out. ESEC 3100SC Plus available as complete solution. Ma...
Asia - Trusted Seller
ESEC ESEC 3006
used
- Manufacturer: ESEC
- Model: 3006
Weight 1,213 lb (550 kg) Exterior Dimensions Width 275.591 in (700.0 cm) Depth 27.559 in (70.0 cm) Height 76.378 in (194.0 cm) AVAILABLE VINTAGE: 1995 GOOD CONDITION 1997(2) GOOD CONDITION
Asia - Trusted Seller
1995 ESEC 2005 HR
used
- Manufacturer: ESEC
- Model: 2005
Die bonder ESEC 2005 HR is a high-speed die attacher that provides simultaneous die bonding capabilities for a wide range of substrates such as single- and multi-die devices and flip chips. Find more here - htt...
Biñan, Philippines 
ESEC3088 | Esec | I/O Module
new
- Manufacturer: ESEC
- Model: 3088
details Esec ESEC3088 !!! Contact: Jessica | jessica01235483 Wechat: hu18030235311 | Mobile: 86-18030235311(WhatsApp) The TU811 is a 8 channel compact module termination unit. The TU811 has three rows of termi...
$666 USDXiamen, Fujian, China
2004 ESEC 2008xP
used
- Manufacturer: ESEC
- Model: 2008 xP
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea- Trusted Seller
ESEC 3088
used
- Manufacturer: ESEC
- Model: 3088
ESEC 3088 Gold Wire Bonder Ex-Works. Multiple sets available on stock.
Malacca, Malaysia 
2006 ESEC 2008hS3 plus
used
- Manufacturer: ESEC
- Model: 2008 HS3 Plus
De-installed, Warehoused, Can be inspected Wafer size: 300MM
Seoul, South Korea- Trusted Seller
ESEC 2100XP DIE BONDER used semiconductor equipment
used
- Manufacturer: ESEC
- Model: 2100 xP
ESEC 2100XP DIE BONDER – Vintage 2011 We can Install & Maintain all ESEC Bonders as of 2016 Strip handler STH 84 cold; wafer handler 300mm; PDS; vision system; wafer mapping. contact: Used Semiconductor Equipment...
Killinick, Ireland 
Erfurt, Germany
Erfurt, Germany- Trusted Seller
Steinhausen, Switzerland - Trusted Seller
Steinhausen, Switzerland